SSMB Male Microstrip Flange Mount Solder Connector

SSMB Male Microstrip Flange Mount Solder Connector – Precision RF Interconnect Solution 

SIPU RF Technology announces the SSMB Male Microstrip Flange Mount Solder Connector (Model: SIPU-SSMB-JFD1) for high-density RF applications requiring the best possible reliability and space-saving integration. This miniaturised interconnect system has a characteristic impedance of 50Ω from DC to 3 GHz with a VSWR of ≤1.35 and insertion loss of ≤0.6√f (GHz) dB. Constructed from military grade materials, the connection has a bronze outer conductor and a beryllium bronze core contact, both gold plated, and can resist harsh temperatures from -65°C to +125°C. It has a dielectric withstanding voltage of 500V and an insulation resistance of > 1,000 MΩ, providing steady performance for mission-critical systems. The strong flange attachment of the straight microstrip arrangement is suited for high vibration settings where mechanical integrity is important.

Key Design Features

The easy PCB integration as well as the reduction of the signal route loss is possible with a straight microstrip layout. It is designed with a flange-mount construction to improve the mechanical strength and vibration resistance, important for aerospace and defence applications.

The solderable construction allows for efficient assembly operations and may thus be used for high-volume manufacturing without sacrificing the connection reliability. The SSMB connector is a small interface that guarantees robust and dependable connections in high-density RF systems.

Gold plating on both center and outer conductors minimises contact resistance and maximises corrosion resistance.  This surface treatment makes the product usable even under adverse environmental conditions.

SSMB Male Microstrip Flange Mount Solder Connector Specifications

Materials and Construction

Outer Conductor: Brass with gold plating for superior conductivity and corrosion protection.

Center Conductor: Beryllium bronze with gold plating ensures excellent spring characteristics and long-term contact reliability.

Insulating Medium: PTFE (Polytetrafluoroethylene) features excellent dielectric properties, good thermal stability during soldering, and consistent electrical performance across the full operating temperature range.

The combination of these premium materials ensures your interconnect solution performs reliably in telecommunications infrastructure, test equipment, and industrial electronics applications.

Quality Control Process

SIPU RF Technology implements rigorous quality assurance protocols for every SSMB Male Microstrip Flange Mount Solder Connector. Each batch is subject to dimensional accuracy verification using video measuring machines to ensure stable connection, signal transmission and mounting performance.

Plating thickness testing utilizes X-Ray Fluorescence (XRF) technology to confirm gold plating meets specifications for long-term durability. Dielectric withstanding voltage and insulation resistance are tested using insulation voltage testers to guarantee electrical safety.

Every batch receives RoHS environmental compliance testing. Plating quality inspection includes both thickness measurement and bonding force evaluation to ensure coating integrity under thermal and mechanical stress.

Mechanical durability testing verifies the connector maintains proper retention force after repeated mating cycles. This comprehensive approach ensures you receive connectors that meet stringent industry standards.

Application Scenarios

Your SSMB Male Microstrip Flange Mount Solder Connector excels in telecommunications equipment, particularly 5G small cell base stations and MIMO antenna arrays where compact microstrip-to-module transitions are essential.

In aerospace and avionics systems, the lightweight design combined with flange-mounted mechanical stability makes it suitable for flight control computers and UAV signal processing units operating under extreme G-forces.

Test and measurement equipment benefits from the connector's high mating cycle rating. Dense multi-port switch matrices and automated test equipment (ATE) require frequent connections without sacrificing RF shielding effectiveness—this connector delivers exactly that.

Industrial electronics applications requiring high-density RF layouts also benefit from the compact SSMB interface and reliable solder mounting method. The robust construction ensures consistent performance in high-vibration manufacturing environments.

Frequently Asked Questions

Q: What makes this connector suitable for high-vibration environments?

A: The flange-mount design provides superior mechanical stability compared to surface-mount alternatives. The mounting holes distribute stress evenly, preventing solder joint failure under vibration and mechanical shock.

Q: How does the straight microstrip configuration benefit my PCB layout?

A: The straight design minimizes signal path length and reduces impedance discontinuities. This results in lower insertion loss and better signal integrity, especially important in multi-layer PCB designs with controlled impedance traces.

Q: What quality testing does each connector undergo?

A: Each batch receives dielectric withstanding voltage testing, insulation resistance verification, plating thickness measurement, and RoHS compliance testing. These tests ensure electrical safety and environmental compliance without exception.

Q: What payment methods do you support?

A: We accept T/T (bank transfer), L/C (letter of credit), and Western Union, depending on your order requirements and agreement terms.

Contact Us for Your RF Interconnect Needs

Our SSMB Male Microstrip Flange Mount Solder Connector's team stands ready to support your specific application requirements. Contact us at info@sipuconn.com for technical consultation, samples, or custom solutions tailored to your needs.